Developmental results
- Flexible OLEDs on stainless steel foil
- Flexible OLED devices on EXPEEK® film with high-temperature torelance
- Laminating encapsulation for flexible devices
Flexible OLEDs on stainless steel foil
Technological developmental results:Flexible OLEDs on stainless steel foil
(In cooperation with: NIPPON STEEL & SUMITOMO METAL CORPORATION)
Stainless steel foil has several advantages, such as temperature resistance, chemical stability, excellent gas barrier properties, etc. However, the surface smoothness has been a big issue regarding application to OLED devices. To solve this issue, NIPPON STEEL & SUMITOMO METAL CORPORATION GROUP developed a surface planarization technology for stainless steel foil (1-4).
Technological features
Advantages of the stainless steel foils of NIPPON STEEL & SUMITOMO METAL CORPORATION GROUP (1)
- Thickness: 50 μm
- Excellent surface smoothness (Ra to 0.6 nm)
- Excellent temperature and process resistances
- High gas barrier ability
Developed technologies
Flexible OLEDs on stainless steel foil
A stainless steel foil with an inorganic-organic planarization layer developed by NIPPON STEEL & SUMITOMO METAL CORPORATION GROUP was applied to flexible OLED devices.
References:
[1] N. Yamada, S. Yamaguchi, J. Nakatsuka, Y. Hagiwara, K. Uemura, IDW’15, FMC3-1 (2015).
“Planarized Stainless Steel Foil for Flexible Substrate”
[2] M. Koden, T. Furukawa, T. Yuki, H. Kobayashi, H. Nakada, IDW/AD’16, FLX3-1 (2016).
“Substrates and Non-ITO Electrodes for Flexible OLEDs”
[3] Y. Hagiwara, H. Itoh, T. Furukawa, H. Kobayashi, S. Yamaguchi, N. Yamada, J. Nakatsuka, M. Koden, H. Nakada, IDW/AD’16, FLXp1 – 5 (2016).
“Roll-to-Roll Processing of Silver/ITO Continuous Deposition on Planarized Stainless Steel Foil”
[4] Y. Hagiwara, T. Furukawa, T. Yuki, S. Yamaguchi, N. Yamada, J. Nakatsuka, M. Koden, H. Nakada, IDW’17, FLXp1-9L (2017).
“Roll-to-Roll Patterning of Reflective Electrode on Planarized Stainless Steel Foil”
Collaboration
NIPPON STEEL & SUMITOMO METAL CORPORATION GROUP
Related programs
- Yamagata University Flexible Electronics Japan-Germany International Collaborative Practical Utilization Consortium (YU-FIC) (Oct. 2017 to Mar. 2021)
- MEXT: Construction Program of Open Innovation Organization (FY2018 to FY2022)
Publications
- Yamagata University, “JFlex 2019” exhibition (Tokyo, Jan. 2019)