Developmental results

Laminating encapsulation for flexible devices

Technological developmental results:Laminating encapsulation for flexible devices
(In cooperation with: Ajinomoto Co., Inc. / Ajinomoto Fine-Techno Co., Inc.)

We develop flexible OLED devices, using the AFTINNOVATM EF laminating encapsulating film developed by Ajinomoto Co., Inc./Ajinomoto Fine-Techno Co., Inc.

Technological features

  • AFTINNOVATM EF substrate, preventing water penetration from the side of the OLED device
  • Simple device architecture and simple fabrication process
  • Reduction of defect occurrence via the stress release effect of AFTINNOVATM EF
    (AFTINNOVATM is a registered trademark of Ajinomoto Co., Inc. )

Developed technologies

  • High gas barrier property:
    – No actual damage after a storage test of 8,000 hours under 60ºC/90%RH
    – WVTR (Water Vapor Transmission Rate): Order of 6‒10 g/m²/day (60ºC/90%RH)
  • Flexible OLED devices

Video sample (bending test)


Ajinomoto Co., Inc./Ajinomoto Fine-Techno Co., Inc.

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